4 semesters
English
1,500+ EUR/sem
Winter
Course description will be available soon. Please contact the university for more details.
How to apply
What you need to apply for Integrated Circuit Design at Technical University of Munich (TU Munich - TUM)
What to prepare for your application to Integrated Circuit Design
Submit Notarised Hardcopy Documents
You do not need to submit any hardcopies until your application has been reviewed and you have received an offer of admission.
If you receive an offer of admission, you will be required to submit the following to TUM Asia:
A signed printout of the Offer of Admission (Official and Student copies) and the Student Agreement Form
All mandatory hardcopy documents and notarised academic documents
The signed application form
If we have informed you to mail your signed offer and notarised hardcopy application documents to us, you may mail them to:-
Office of Admissions, TUM Asia
510 Dover Road, #05-01 SIT@SP Building
Singapore 139660
Please do not mail any documents unless specifically requested. Note that we do not return any documents submitted under any circumstances.
Step-by-step guide to applying for Integrated Circuit Design at Technical University of Munich (TU Munich - TUM)
Apply via
direct
Mode
online_plus_hardcopy
Application fee
Free
Tuition
1,500+ EUR
per semester
Semester contribution
85 EUR
per semester
Application fee
Free
one-time
Statistics will appear here as more applicants report their outcomes. Check back later for acceptance rates and grade benchmarks.
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Open application portalApostille and notarization
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Address
Technical University of Munich (Asia Campus)
510 Dover Road SIT@SP Building#05-01
Singapore 139660
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Estimated year-1 total cost
15,074 – 24,074 EUR
Includes tuition, semester contribution, and estimated living costs. Range accounts for lifestyle differences.
Additional fee information
Pay the processing fee of SGD 109 (GST Inclusive)
S$56,156.80
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